Specialized in tailored package solutions
NedCard develops semiconductor package solutions and offers related assembly and test services for various devices used in smart card, RFID, sensor, IoT, M2M and other enabling technologies.
We work globally with plants in Europe and Asia and have over 20 years of experience in offering package solutions for Banking & Payment, Telecom, eGovernment & Identification and Emerging markets. We apply extensive technical capabilities to meet the industry’s highest requirements. Trustworthiness is what makes us unique; we provide maximum security and cost-efficient manufacturing while meeting high quality standards.
NedCard recently introduced MicroSON®-3 SMD package. A near chip scale plastic encapsulated package designed for industrial applications. It is robust, reliable, small and compatible with leading UHF RFID chip solutions in the market.